On April 12, Shennan Circuits announced the report for the first quarter of 2022, achieving operating income of 3.316 billion yuan, a year-on-year increase of 21.68%; net profit attributable to the parent was 348 million yuan, a year-on-year increase of 42.83%.
![【制造/封测】深南电路2022年Q1净利润3.48亿元,同比增加42.83% 【制造/封测】深南电路2022年Q1净利润3.48亿元,同比增加42.83%](https://img.dramx.com/website/dramx/20220413091708_%E5%9B%BE%E7%89%871.png)
Image source: Screenshot of Shennan Circuit's announcement
On March 14th, Shennan Circuit released its 2021 annual report. In 2021, its operating income was 13.943 billion yuan, a year-on-year increase of 20.19%; the net profit attributable to the parent was 1.481 billion yuan, a year-on-year increase of 3.53%.
From a business perspective, the printed circuit board business of Shennan Circuits achieved a main business income of 8.737 billion yuan, a year-on-year increase of 5.13%, accounting for 62.66% of the company's total operating income.
During the reporting period, Shennan Circuits made significant progress in the development of automotive electronics customers, with orders increasing by 150% year-on-year. The construction of the company's professional automotive electronics factory (Nantong Phase III project) is progressing smoothly, and it has been put into operation in the fourth quarter of 2021.
The main business income of Shennan circuit packaging substrate business was 2.415 billion yuan, a year-on-year increase of 56.35%, accounting for 17.32% of the company's total operating income; gross profit margin was 29.09%. Among them, the annual orders for storage products increased by 140% year-on-year. The Wuxi substrate factory has successfully climbed the slope and has entered a stable mass production stage.
Facing the continuous high demand for packaging substrates, Shennan Circuits will invest in the construction of packaging substrate factories in Guangzhou and Wuxi in 2021. The Guangzhou packaging substrate project plans to invest 6 billion yuan, mainly for packaging substrates such as FC-BGA, RF and FC-CSP. The project is currently in the preparatory stage. The Wuxi high-end flip-chip IC carrier product manufacturing project plans to invest 2.016 billion yuan, mainly for high-end storage and FC-CSP and other packaging substrates. It is expected to be put into production in the fourth quarter of 2022.
Source of information: Global Semiconductor Watch official website (www.dramx.com)